Ceramic substrate has been widely used in the field of electronic smog and non combustion due to its excellent properties such as low thermal resistance, high pressure resistance, high heat dissipation and long life. The function of electronic smoke heating element is similar to that of computer to Intel chip, and the metallization circuit on the surface of ceramic substrate is an important prerequisite for its practical application.
Ceramic surface metallization technology is widely used in the field of electronic ceramics. Due to the fast heating response, its application in the field of electronic smoke is gradually expanding. In the field of small smoke, there are the feelm ceramic atomizing core of mcwell smoore, the silmo of zhuolineng ALD, and the FXR. In the heating non combustion HNB, there are the iqos ceramic heating plate. The following is the introduction of metallization process of some ceramic substrate surface of small finishing for reference;
1. Thick film technology
Thick film technology, through the screen printing of metal powder slurry on ceramics, and then through high-temperature sintering degreasing to make the metal powder melt into a whole.
10 methods of surface metallization of electronic smoke ceramic heating parts
Figure thick film printing process flow
2. DPC direct plate copper
Sputtering copper coating refers to the metallization of thin films on the surface of direct plate copper (DPC) by means of vacuum sputtering, and the high-density double-sided wiring and vertical interconnection by means of yellow light micro shadow and perforation plating.
3. Bonding copper clad (DBC)
The bonding copper is direct bond copper (DPC). The copper foil is coated on the surface of the ceramic. At high temperature, the chemical reaction takes place at the interface to form a new phase cualo2 or Zhu tightly. The advantage of this process is that it is suitable for secondary etching. The copper layer is very thick and the reliability is the highest.
4. Bonding aluminum clad (DBA)
The bonding aluminum coating is direct bond aluminum (DPA), which has good wettability to the ceramic in the liquid state to realize the bonding between the two. The bonding aluminum is directly wetted on the ceramic surface by melting the aluminum. When the temperature rises above 660 ℃, the solid aluminum liquefies. When the liquid aluminum moistens the ceramic surface, with the decrease of temperature, the crystal nucleus provided by aluminum directly grows on the ceramic surface, and the combination of the two is realized when the temperature is cooled to room temperature.
5. Active technology brazing
The active metal solder is printed on the surface of ceramic, which is welded with oxygen-free copper foil in vacuum brazing furnace. The surface circuit is made by wet etching process of PCB. The welding deformation is small, the joint is smooth and beautiful, and it is suitable for welding precise, complex and different material components.
6. Selective laser sintering (LAM)
The ceramic and metal ions are treated by high energy laser beam, which makes them firmly combined.
7. Chemical plating
Electroless plating is a process of metal deposition by controlled redox reaction under the catalysis of metal.
8. Thermal spraying
The molten spraying material (metal or non-metal) is atomized and sprayed on the surface of the pretreated substrate by high-speed air flow.
9. Plasma spraying
The metal is heated to melting by plasma arc, and then hit the substrate surface under the traction of plasma current.
10. Molybdenum manganese method
Molybdenum manganese powder was mixed with organic binder to form paste and coated on the surface of ceramics. After high temperature sintering in reducing atmosphere, metallization was obtained, then nickel plating was carried out, and finally soldered with metal parts.
As an oral product, electronic cigarette has higher requirements for food safety. The most common method used in electronic cigarette is thick film technology, which is used in heating non combustion and oil type electronic cigarette.
The advantage of thick film technology lies in the product with the same size and resistance value, which can design many kinds of wiring schemes and obtain different effects; the product can be designed directionally to obtain the product with the best heat distribution, achieve good heating and atomization effect, and improve the thermal efficiency and save electricity.